Features:
Multi direction, multi angle 3D PMP inspection
3D solder paste inspection based on white-light sine stripe PMP tech.
Solder paste height inspection accuracy reaches 1 um.
Auto-restore pad 3D data on PCB surface, calculate the volume, area, height and deviation of every solder paste.
Double-3D Projection, solved the lighting source shadow caused inspection deviation during the testing processing，Bilateral projection can solve the shadow effect 100%.
Vivid and easy to used graphic interaction interface.
Comprehensive function and easy to handle.
Multi-touch function can realize 3D image rotation and 2D image resizing.
Comprehensive SPC function concluded every kind statistical statement. Auto generation and output report and statement.
Image accelerate calculations base on GPU;
At most 80% CPU operation time can be saved than before.
Parameters：
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Model
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SPI-600-M
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SPI-600-L
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|
Camera Specification
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4M, 8M High-frequency Industrial Camera, High Frame Number (Factory Setting)
Pixel
|
|
Pixel
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18um/Pixel,15um/Pixel,12um/pixel (Factory setting)
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|
FOV
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2500mm2,1700mm2,900mm2(Factory setting)
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|
Height Range
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0-550um
|
|
Height Resolution
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0.36um
|
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Height Accuracy
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1um(Based on the actual solder paste/calibration block）
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Inspection Item
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Volume、Area、Height、X/Y position、Bridging、Shape.etc
|
|
Defection Types
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Excessive/Insufficient/missing paste, Bridge 2D&3D,Paste displacement, Shape deformity, Dust, etc
Repeatability (Volume, Area, Height)
|
|
Repeatability (Volume, Area, Height)
|
<1%@3Sigma
|
|
GR&R (Gauge Reproduceablity and Repeatablity)
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<10% (6Sigma tolerance=+/-50%)
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|
Inspection Speed
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0.3S/FOV
|
|
Max PCB Size
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330x250mm
|
520x520mm
|
|
Min PCB Size
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50x50mm
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50x50mm
|
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PCB Up-Clearance
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30mm
|
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PCB Bottom-Clearance
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30mm
|
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PCB Thickness
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0.3-5mm
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Max PCB Warpage
|
7mm
|
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PCB Transfer Height
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3mm
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|
PCB Transfer Height
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880-920mm
|
|
Max PCB Weight
|
3Kg
|
|
Base & Frame
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Integral Steel casting frame, firmly, ensure the high accuracy of Inspection
|
The actual machine should be prevail if parameters changed.
